Each material pulled apart from a board Inky built on it, layer by layer as its file states
Every board here, built by Inky.
17 boards on 7 materials, each started by one brief. Each was checked again for this page, by DRC on its own board file: 0 errors, 0 unconnected.
01 · Glass-woven epoxy
FR-4
The rigid board nearly everything starts on, and the one every heypcb board gets unless you name another.
- Build
- 2 copper layers · 1.6 mm
- Core
- FR-4
As the ESP32-S3 dev board’s board file states it
ESP32-S3 dev board
DRC 0 errors · 0 unconnected
34 × 66 mm · 29 parts · 514 tracks
The brief: “Design an ESP32-S3 dev board: USB-C, LiPo charger, two buttons, an RGB LED and pin headers. Green FR-4, fully routed, DRC clean.”
02 · Polyimide
Flex
A board that bends: wearables, probes, and the cable that folds into the case, under a polyimide coverlay.
- Build
- 2 copper layers · 0.11 mm
- Core
- Polyimide · 0.031 mm · εr 3.3
- Cover
- Polyimide coverlay · 0.028 mm
- Finish
- ENIG
As the LED arc’s board file states it
LED arc
DRC 0 errors · 0 unconnected
70 × 35 mm · 20 parts · 294 tracks
The brief: “A flexible LED arc on polyimide flex.”
The whole brief +The whole brief −
- 2-layer JLCPCB FPC, 0.11 mm polyimide, yellow coverlay, ENIG; a half ring 70 mm across, 8 mm wide. - Nine WS2812B-2020 RGB LEDs (or the XL-2020RGBC-2812B) evenly along the arc on one data chain, each with its own 100 nF capacitor. - A 3-pin 1 mm pitch connector at one end for 5V, DIN and GND, with a 330 ohm resistor in series with DIN. Set the board's stackup to that polyimide flex before you place anything. Route it completely and leave it DRC clean.
IMU tail
DRC 0 errors · 0 unconnected
40 × 10 mm · 6 parts · 55 tracks
The brief: “A flexible IMU tail on polyimide flex.”
The whole brief +The whole brief −
- 2-layer JLCPCB FPC, 0.11 mm polyimide, yellow coverlay, ENIG; a 40 x 10 mm strip with rounded ends. - At one end an in-stock 6-axis IMU in a small LGA package (the LSM6DS3TR-C or similar) in I2C mode, with its decoupling capacitors beside it. - At the other end a 4-pin 1 mm pitch connector for 3V3, GND, SDA and SCL, with 4.7 kohm pull-ups on SDA and SCL. - Keep the middle of the strip free of parts so it can bend. Route it completely and leave it DRC clean.
Display adapter
DRC 0 errors · 0 unconnected
50 × 20 mm · 16 parts · 102 tracks
The brief: “A flexible display adapter on polyimide flex.”
The whole brief +The whole brief −
- 2-layer JLCPCB FPC, 0.11 mm polyimide, yellow coverlay, ENIG; 50 x 20 mm. - A 12-pin 1 mm pitch FPC connector at one end wired pin for pin to a 12-pad row of 2.54 mm solder pads at the other, with a 100 nF and a 10 uF capacitor across the supply pins and a backlight resistor. Route it completely and leave it DRC clean.
Temperature probe
DRC 0 errors · 0 unconnected
6 × 60 mm · 5 parts · 60 tracks
The brief: “A flexible temperature probe on polyimide flex.”
The whole brief +The whole brief −
- 2-layer JLCPCB FPC, 0.11 mm polyimide, yellow coverlay, ENIG; a 60 x 6 mm strip. - An in-stock digital I2C temperature sensor in a small package (the TMP102 or similar) at the tip, with a 100 nF capacitor beside it. - A 4-pin 1 mm pitch connector at the base for 3V3, GND, SDA and SCL, with 4.7 kohm pull-ups on SDA and SCL. Route it completely and leave it DRC clean.
03 · Metal core
Aluminium
One copper layer on a thin thermal dielectric over an aluminium base, for LEDs that run hot.
- Build
- 1 copper layer · 1.6 mm
- Core
- Thermal dielectric 1 W/mK · 0.13 mm
- Base
- Aluminium 1060 · 1.425 mm
- Finish
- HASL lead-free
As the 6 × 6 LED panel’s board file states it
6 × 6 LED panel
DRC 0 errors · 0 unconnected
60 × 60 mm · 52 parts · 100 tracks
The brief: “A 6 x 6 LED panel light on aluminium.”
The whole brief +The whole brief −
- JLCPCB aluminium board, 1.6 mm, 1 W/mK dielectric, white solder mask, black silkscreen, 1 oz copper; 60 x 60 mm, with M3 mounting holes in two opposite corners 4 mm in. - Thirty-six white 2835 LEDs of about 0.5 W (in stock at LCSC) on a 9 mm grid. - Twelve strings of three LEDs, each with its own 1206 ballast resistor sized for about 60 mA from 12 V. - 12 V in on two large wire pads, LED+ and LED-, at one edge. - Front copper only and no vias, as the aluminium process requires; every connection on the one layer with no crossings. Route it completely and leave it DRC clean.
LED light bar
DRC 0 errors · 0 unconnected
120 × 28 mm · 20 parts · 44 tracks
The brief: “A 12-LED light bar on aluminium.”
The whole brief +The whole brief −
- JLCPCB aluminium board, 1.6 mm, 1 W/mK dielectric, white solder mask, black silkscreen, 1 oz copper; 120 x 28 mm, with two M3 mounting holes on the centre line, 6 mm in from each short end. - Twelve white 3030 LEDs of about 1 W (pick an in-stock LCSC 3030 white LED rated at least 150 mA) evenly spaced in one row along the middle of the bar. - Four strings of three LEDs: each string runs from an LED+ rail to an LED- rail through its own 1206 ballast resistor sized for about 150 mA from 12 V (three white LEDs drop about 9 V, leaving headroom for the resistor); LED+ as one straight wide rail along the top edge, LED- along the bottom edge. - 12 V in on two large wire pads (LED+ and LED-) at one end; no other parts. - Front copper only and no vias, as the aluminium process requires; every connection on the one layer with no crossings. Route it completely and leave it DRC clean.
3 × 3 LED light
DRC 0 errors · 0 unconnected
40 × 40 mm · 16 parts · 28 tracks
The brief: “A 3 x 3 LED light on aluminium.”
The whole brief +The whole brief −
- JLCPCB aluminium board, 1.6 mm, 1 W/mK dielectric, white solder mask, black silkscreen, 1 oz copper; 40 x 40 mm, with two M3 mounting holes in opposite corners 4 mm in. - Nine white 3030 LEDs of about 1 W (in stock at LCSC, rated at least 150 mA) on a 10 mm grid. - Three strings of three LEDs, each with its own 1206 ballast resistor sized for about 150 mA from 12 V. - 12 V in on two large wire pads, LED+ and LED-, at one edge. - Front copper only and no vias, as the aluminium process requires; every connection on the one layer with no crossings. Route it completely and leave it DRC clean.
LED star
DRC 0 errors · 0 unconnected
20 × 20 mm · 3 parts · 2 tracks
The brief: “A round LED star on aluminium.”
The whole brief +The whole brief −
- JLCPCB aluminium board, 1.6 mm, 1 W/mK dielectric, white solder mask, black silkscreen, 1 oz copper; a 20 mm diameter disc. - One 3 W white LED in a 3535 package (pick an in-stock LCSC part rated at least 700 mA) in the exact centre, its thermal pad on a large copper island. - Two large solder pads for LED+ and LED- on opposite sides near the rim, marked + and - on the silkscreen. - Front copper only and no vias, as the aluminium process requires. Route it completely and leave it DRC clean.
04 · Direct heatsink
Copper core
A copper base raised under each part's thermal pad, so the heat goes straight into the metal.
- Build
- 1 copper layer · 1.6 mm
- Core
- FR-4 · 0.2 mm · εr 4.5
- Base
- Copper · 1.355 mm
- Finish
- OSP
As the 3 W LED engine’s board file states it
3 W LED engine
DRC 0 errors · 0 unconnected
80 × 48 mm · 22 parts · 85 tracks
The brief: “Six 3 W LEDs on a direct-heatsink copper core.”
The whole brief +The whole brief −
- JLCPCB's direct-heatsink copper core, 1.6 mm, white mask with black silk, 80 × 48 mm with four M3 mounting holes. - Six 3 W high-power white LEDs with thermal pads in one series string, in two rows of three, each thermal pad on a direct heatsink pad. - A PT4115 constant-current buck driver from a 24 V input on a 2-pin JST connector, its sense resistor sized for the LEDs' rated current, the inductor and Schottky from its datasheet, and an NTC on the board for thermal derating. - Front copper only, no vias, as the copper-core process requires. Route it completely and leave it DRC clean.
Six-LED ring
DRC 0 errors · 0 unconnected
44 × 44 mm · 8 parts · 25 tracks
The brief: “Six 3 W LEDs in a ring on a copper core.”
The whole brief +The whole brief −
- JLCPCB copper-core board (direct heatsink), 1.6 mm, white solder mask, black silkscreen, OSP; a round board 44 mm across. - Six Samsung LH351-class 3 W 3535 LEDs (the SPHWHTL3DA0GF4VPN6 or similar, whose thermal pad is electrically isolated) evenly round a 30 mm circle, in series for an external constant-current driver, each LED's thermal pad on a direct heatsink pad. - Two wire pads, LED+ and LED-, near the edge. - Front copper only and no vias, as the copper-core process requires. Route it completely and leave it DRC clean.
05 · RO4350B laminate
Rogers
A steady, low-loss ceramic laminate for RF lines, amplifiers and antennas.
- Build
- 2 copper layers · 1.524 mm
- Core
- Rogers RO4350B · 1.455 mm · εr 3.48
- Finish
- ENIG
As the Low-noise amplifier’s board file states it
Low-noise amplifier
DRC 0 errors · 0 unconnected
40 × 24 mm · 19 parts · 115 tracks
The brief: “A 0.6–6 GHz low-noise amplifier on Rogers RO4350B.”
The whole brief +The whole brief −
- Stackup: Rogers RO4350B (εr 3.48), 2 layers, 0.508 mm (20 mil) core, 1 oz copper, ENIG finish, black solder mask, 32 × 20 mm. - A Qorvo QPL9503 LNA (LCSC C470924) with the matching and bias network from its datasheet. - A Samtec SMA-J-P-H-ST-EM1 edge-launch SMA (LCSC C5199907) at each short edge, RF in and RF out, on KiCad's Connector_Coaxial:SMA_Samtec_SMA-J-P-H-ST-EM1_EdgeMount footprint. - 50 Ω grounded coplanar waveguide from each SMA to the LNA, sized for RO4350B, with a row of stitching vias along both sides of each line. - A 5 V input on a 2-pin header with reverse-polarity protection, an LDO for the LNA's supply, decoupling at every supply pin, and a power LED. - A solid ground pour on both layers, stitched with vias. Route it completely and leave it DRC clean.
2.4 GHz power amplifier
DRC 0 errors · 0 unconnected
30 × 22 mm · 8 parts · 72 tracks
The brief: “A 2.4 GHz power amplifier on Rogers RO4350B.”
The whole brief +The whole brief −
- 2-layer Rogers RO4350B, 0.508 mm; about 30 x 22 mm. - An in-stock 2.4 GHz RF power amplifier IC with the bias, matching and decoupling its datasheet asks for. - u.FL connectors for RF in and RF out, each on a short 50 ohm grounded coplanar line. - A 3-pin header for VCC, enable and GND. - Ground pours on both sides stitched with vias. Set the board's stackup to that Rogers laminate before you place anything. Route it completely and leave it DRC clean.
06 · RT/duroid laminate
PTFE
The lowest-loss laminate here, for radar and antennas at tens of gigahertz.
- Build
- 2 copper layers · 0.289 mm
- Core
- RT/duroid 5880 · 0.254 mm · εr 2.2
- Finish
- ENIG
As the 24 GHz radar’s board file states it
24 GHz radar
DRC 0 errors · 0 unconnected
40 × 40 mm · 29 parts · 270 tracks
The brief: “A 24 GHz motion-sensing radar on PTFE.”
The whole brief +The whole brief −
- Stackup: Rogers RT/duroid 5880 PTFE (εr 2.20, loss tangent 0.0009), 2 layers, 0.254 mm, 1/2 oz copper, ENIG finish, white solder mask, 40 × 40 mm with 2 mm corners. - An Infineon BGT24LTR11N16 radar transceiver (LCSC C534254) near the middle, with the supply decoupling, VCO tuning and IF circuit from its datasheet. - On the top half, a transmit and a receive antenna side by side, each a 1 × 4 series-fed microstrip patch array: four patches about 4.9 mm wide and 4.0 mm long (24.125 GHz on this laminate), drawn as copper zones on the TX or RX net and joined by short 50 Ω microstrip sections about 9 mm centre to centre, fed from the transceiver by 50 Ω microstrip sized for εr 2.20. A solid ground plane on the back, and no solder mask over the patches. - On the bottom half, a dual op-amp (MCP6022) amplifying the I and Q IF outputs, a 3.3 V LDO, and a 6-pin header for a microcontroller: 3V3, GND, IFI, IFQ, VTUNE and EN. Route it completely and leave it DRC clean.
3-way RF splitter
DRC 0 errors · 0 unconnected
32 × 32 mm · 6 parts · 38 tracks
The brief: “A resistive 3-way RF splitter on PTFE.”
The whole brief +The whole brief −
- 2-layer board on 0.254 mm Rogers RT/duroid 5880 (PTFE), ENIG, white solder mask; 32 x 32 mm. - Three edge-launch SMA connectors: one on the left edge, one on the top edge, one on the right edge. - A star of three 0402 16.9 ohm resistors at the centre joining the three ports, each port reached by a short straight 50 ohm microstrip line on F.Cu. - A solid ground plane on the back, ground stitching vias around the board edge. Route it completely and leave it DRC clean.
07 · Laser microvias
HDI
Not a laminate but a way of building FR-4: laser microvias in the balls of a fine-pitch chip, on a board the size of a thumb.
- Build
- 6 copper layers · 1.6 mm · 7 laser microvias
- Core
- FR-4 · 1.461 mm across 5 layers · εr 4.5
- Finish
- ENIG
As the FPGA stick’s board file states it
FPGA stick
DRC 0 errors · 0 unconnected
30 × 20 mm · 23 parts · 259 tracks
The brief: “A thumb-sized FPGA stick on 6-layer HDI.”
The whole brief +The whole brief −
- A 6-layer HDI board for JLCPCB (1+N+1, laser microvias), ENIG, about 24 × 16 mm. - A Lattice iCE40UP5K in its 0.4 mm WLCSP-30 package (ICE40UP5K-UWG30ITR, LCSC C2678192): its balls are too close for through vias, so they escape on laser microvias. - A W25Q16JVUXIQ SPI flash (C2843335) holding its bitstream, a USB-C receptacle for 5 V power, a 3.3 V LDO and a 1.2 V LDO for the core, an RGB LED on the FPGA's RGB driver pins, and a CRESET button. Route it completely and leave it DRC clean.
Audio board
DRC 0 errors · 0 unconnected
30 × 20 mm · 27 parts · 264 tracks
The brief: “An STM32F411 audio board on 6-layer HDI.”
The whole brief +The whole brief −
- 6-layer HDI, 1+N+1 with laser microvias, 1.6 mm, ENIG; JLCPCB's HDI design rules (3 mil track and space, 0.25/0.10 mm laser microvias in the array's balls, 0.30/0.15 mm through vias); about 30 x 20 mm. - An STM32F411CEY6TR in its 0.4 mm WLCSP-49 with its decoupling and a 25 MHz crystal. - An in-stock I2S class-D amplifier (the MAX98357A or similar) with its decoupling, driving two speaker pads. - A USB-C receptacle (USB 2.0) with its CC resistors, a 3.3 V LDO from VBUS and four SWD pads. Route it completely and leave it DRC clean.
Order it, or take the files.
Every board downloads the same way. Only FR-4 boards can be ordered from heypcb today.
- FR-4
- Order it from the board’s Order tab, or download its files.
- Flex, metal core, Rogers, PTFE, HDI
- Download the Gerbers and the KiCad project, with the stackup written into the board file, and send them to a fab that makes that material.
What will you
build on it?
Pick a material and describe the board. Inky builds it on that material.