
by thinginogithub.com/thingino/teacup-neo
Universal Ingenic SoC development platform: one carrier + per-SoC interposer modules (T10 through A1, any package) on a DDR4 card edge, with an ESP32-S3 BMC for autonomous LLM-driven development.

Imported from a public repository by thingino. View the source
GPL-3.0 — Share-alike (GPL-3.0): a board you derive from this one must be released under GPL-3.0 too, with source.
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Development boards, breakouts, carriers, HATs and shields — a chip made usable.